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99b8f1493d More layout updates created pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 **Component Count:** 74 **Component Count:** 76 | Refs | Qty | Component | Description | Vendor | SKU | | Tayda | A-1847 | | | | | | | | | | | | | | J1 | 1 | SW_Push | Push button switch OFF-(ON) | Dailywell | PAS7B3M1CESA6-5 | Tayda | A-2939 | | Tayda | A-2939 | | Tayda | A-559 | | | R23, R24, R25, R27 | 4 812d609d12 More assembly notes Latest commits for file caixa_sr1.png Image of caxia score caixa_sr1.png | Bin 0 -> 47687 bytes Hardware/PCB/precadsr/precadsr.pro | 258 Hardware/PCB/precadsr/precadsr.sch | 4 b96c823428 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png differ Binary files /dev/null and b/caixa_sr2.png differ From f50bb0019af1e23a68a47e827989c11465d543f5 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Change op amp, dims to user drawings Add comments and graphics symbols to schematics Hardware/PCB/precadsr/potsetc.sch | 663 Hardware/PCB/precadsr/precadsr.net | 147 Hardware/PCB/precadsr/precadsr.pro | 258 Hardware/PCB/precadsr/precadsr.sch | 412 Hardware/PCB/precadsr/precadsr.xml | 884 main MK_VCO/Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy 6789 lines Latest commits for file MIXER.diy 0 0 Sequencer based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row.

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