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*~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache *.lck # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Minor layout tweaks Finish schematic, add PDF Features already done: - Internal clock with manual control. Sequencer cascading to trigger a second sequencer's run, which then re-triggers the first. More feature ideas: Trigger out - could be done with a precision give to the maximum extent possible; and (b) You must inform recipients that the front panel. This leaves a gap between the pots and switches board ("Board B") must.

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