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MCV_1,5/3-G-3.5; number of pins: 14; pin pitch: 3.50mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1843703 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/6-GF-3.81; number of pins: 05; pin pitch: 7.50mm; Angled || order number: 1924460 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/2-GF-5.08; number of pins: 13; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924046 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/16-GF-3.5; number of pins: 03; pin pitch: 5.08mm; Angled || order number: 1847482 8A 320V Generic Phoenix Contact SPT 1.5/10-H-3.5 Terminal Block, 1991040 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991040), generated with kicad-footprint-generator Diode SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-6.pdf Mini-Circuits Filter SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6, Wuerth electronics 9771080360 (https://katalog.we-online.com/em/datasheet/9771080360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm.

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