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Back# LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 16 Latest commits for file Panels/FireballSpell_Large_bw.png 9bb3093b2b Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png | Bin 0 -> 10724 bytes .../Panels/MAGIC MISSILE VCF.png Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/SOT-23_Handsoldering.kicad_mod Normal file View File 3D Printing/Pot_Knobs/Pot Knob in Two Parts.stl Executable file View.
- (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator Harting.
- Connector, LY20-20P-DT1, 10 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf.
- 90325-0016, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- 5.735860e-001 1.353294e-003 8.191442e-001 vertex -5.148046e+000 -2.117684e+000 2.491820e+001.
- 2mm, outer diameter 2mm, outer diameter.