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(UC) - 3x3x0.5 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for the articles that helped implement this. Ct = -0.1; // circle translate? Not sure. // // for inset labels, translating to this height controls label depth width = 12; label_font_size = 5; width_mm=90; height=16; thickness=2; label_inset_height = thickness-1; STLs, 10hp version, others schematics main MK_SEQ/README.md 64 lines From.

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