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Lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 44 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN] with thermal vias.

Href="https://gitea.circuitlocution.com/synth_mages/MK_VCO/commit/afea9d5a2cf23e2a33a2927086270d4d602f5a2b" rel="nofollow">afea9d5a2cf23e2a33a2927086270d4d602f5a2b Final revision; added custom DRC.
0.0624768 -0.076128 0.995139 vertex.
7.25mm SMT Multi-directional Spring Contact (T+R), https://cdn.harwin.com/pdfs/S1941R.pdf.

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