Labels Milestones
BackBGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0830, 8 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of.
- Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6.
- (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990740), generated with kicad-footprint-generator.