Labels Milestones
Back1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 900.
- 0.365094 0.683044 0.63258 facet normal.
- Connect Type055_RT01504HDWU, 4 pins.
- Vertex 4.826502e-002 -6.200762e+000 2.496000e+001.
- (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator Molex Pico-Clasp series.