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BackPhoenix MKDS-1,5-8 pitch 5mm size 50x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block TE 1-282834-1 pitch 2.54mm size 15.7x6.5mm^2 drill 1.1mm pad 2.2mm Terminal Block Phoenix MKDS-3-3-5.08 pitch 5.08mm length 4mm width 2.5mm Capacitor C, Radial series, Radial, pin pitch=29.00mm, , diameter=29.8mm, muRATA, 1400series, http://www.murata-ps.com/data/magnetics/kmp_1400.pdf Inductor Radial series Radial pin pitch 26mm length 20mm diameter 8mm Diode, 5KPW series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=13*4.5mm^2, Fastron, HCCC, http://www.fastrongroup.com/image-show/19/HCCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 5.08mm size 81.3x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix PT-1,5-16-5.0-H, 16 pins, pitch 3.5mm, size 50x8.3mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 502585-1370 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-02P-1.25DSA, 2 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-LC, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-22XX, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin without exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 18 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL.
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