3
1
Back

8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm staggered type-2 TO-220F-4, Vertical, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf.

New Pull Request