Labels Milestones
BackOf http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.693x3.815mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm x 7.4mm, right angle, stacked (https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/484/48406/484060001_sd.pdf USB 3.0 Micro B horizontal dustproof waterproof IP67 XKB Connectivity, USB Micro-B, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2204071530_G-Switch-GT-USB-7010ASV_C2988369.pdf USB Type A, https://gct.co/files/drawings/usb1046.pdf USB SMD Micro USB AB receptable, right-angle inverted (https://www.molex.com/pdm_docs/sd/475900001_sd.pdf Micro AB USB SMD Type-A Receptacle Right Angle Low-profile vertical USB Micro-B Receptacle SMD USB Micro-B horizontal SMD USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro.
New Pull Request