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Slide 8.61mm 338mil SMD LowProfile JPin SMD 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil 8-lead dip package, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball.

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