synth_tools

Back

14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.775x5.041mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 11x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for Siemens SFH900 reflex photo interrupter/coupler/object detector, see https://www.batronix.com/pdf/sfh900.pdf Siemens SFH900 reflex photo interrupter coupler object detector Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for diode bridges, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62.

New Pull Request

Labels Milestones