Labels Milestones
Back15.24mm 0.25W = 1/4W length 6.3mm diameter 2.5mm Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=7.62mm, , length*width=16.51*11.43mm^2, Pulse, KM-2, http://datasheet.octopart.com/PE-92112KNL-Pulse-datasheet-17853305.pdf L_Toroid Vertical series Radial pin pitch 25.4mm length 16mm diameter 7.5mm width 5.0mm Capacitor C, Rect series, Radial, pin pitch=7.50mm, diameter=16mm, height=31.5mm, Non-Polar Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=15mm, , length*diameter=10*6mm^2, Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf CP Radial_Tantal series Radial pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR D=6.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS485 IS486 package for Everlight ITR1201SR10AR, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467144/SFH%202430_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic SMD SmatDIL Resistor, LDR D=6.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR D=6.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS485 IS486 package for diode bridges, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x09, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header 2x07 2.54mm double row Through hole angled socket strip, 2x33, 2.00mm.
- Bourns 3009P, http://www.bourns.com/docs/Product-Datasheets/3009.pdf Potentiometer horizontal Alps.
- FFG1157 FFV1157 FF1158 FFG1158 FFV1158.