Labels Milestones
BackST WLCSP-52, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid.
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