Labels Milestones
BackClearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 26.67 mm.
- 978eb1d01f Fix for component clearance, panel thickness.
- 5x5mm^2, drill diamater 1.3mm, pad diameter 3mm.
- A Circular Fiducial, 1.5mm bare copper.
- Oscillator) Sequencer PSU (power supply unit Outputs ±12V.