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ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/drv8662.pdf#page=23), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 52559-3652, 36 Circuits (https://www.molex.com/pdm_docs/sd/525593652_sd.pdf connector Molex Panelmate series connector, B9B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2104, With thermal vias in pads, 6 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon vertical Harting har-flexicon series connector, 502443-0270 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 8 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, 2-pin, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, 2-pin, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.286mm SIPAK, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 2.54mm TO-220F-4, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3.

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