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LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes.

• , length*width=43.18*22.86mm^2, Bourns, 8100.
• 1.001113e+01 vertex -1.092681e+02 9.665134e+01 9.961018e+00.
• CC4V-T1A series http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf, 5.0x1.9mm^2 package SMD.

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