3
1
Back

- 12x12x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 56 leads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature.

New Pull Request