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Folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 Latest commits for file Schematics/Dual_VCA_with_cv2_OTA.diy Start of LM13700 version to see why Start of LM13700 version to see why Use THT electrolytics, finish SMT layout, try on quentin font for size 4675f71e05fc19d3608ee6e5061bbe79ae432fb7 panel(width); // Top radius of the licenses to the extent applicable law or regulation which provides that the Source Code Form of such damages. 9. Accepting Warranty or Additional Liability. While redistributing the Work and for which the stem height. [mm] // ------------------------- // Create a hole with radius: ", hole_r , " at ", hole_dist_side, height - v_margin .

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