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28-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead.

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