Labels Milestones
BackUFBGA-201, 15x15 raster, 13x13mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid.
- Length*width*height=22.2*8*8mm^3, shunt pin pitch 2.50mm diameter.
- Dot10 Dot11 Dot12 Dot13 W1 L2 <-- CV.
- Wire 0.5sqmm double-strain-relief Soldered wire connection.
- 2 Digit 7 segment.
- 1.6x0.8 mm balun footprint Johanson 0900PC15J0013 DFN.