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BackUp, opposite to expectation. Schematic fixes: - C1 is too small for film; is film needed? More notes Schematics/schematic_bugs_v1.txt | 2 Panels/futura medium bt.ttf From 4d5fa6d9031cd3c77276604f864cee7dad9fcfbf Mon Sep 17 00:00:00 2001 Subject: [PATCH] New KiCad version; non Al panel Gerbers ) ) New KiCad version; non Al panel Gerbers # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ Initial version \#* New KiCad version; non Al panel Gerbers # Netlist files (exported from Eeschema # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with.
- 8 notes means ~$16-20.
- -7.642741e-001 -6.448916e-001 0.000000e+000 vertex -8.221430e-001 6.982005e+000 9.983999e+000.
- Openscad design ## Mechanical assembly Documentation .
- Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865.