Labels Milestones
BackNo-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA.
- 6.35mm, hole diameter 1.3mm, length 10.0mm, width.
- -0.174175 0.890413 facet normal -8.113385e-01 -5.845766e-01.
- XP_POWER IHxxxxSH, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator.