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BackDFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-2549-8-bit-AVR-Microcontroller-ATmega640-1280-1281-2560-2561_datasheet.pdf (page 415)), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 48 Pin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm.
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