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Connector, B10B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST ZE series connector, 53398-0571 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5180, 18 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 5-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator Hirose series connector, 53780-3070 (), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/9-V-5.0-EX Terminal Block, 1719189 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719189), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12858&prodName=TLP291-4), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-1410, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator TE, 826576-5, 5 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810845, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack vertical Molex SPOX Connector System, 43045-2200 (alternative finishes: 43045-062x), 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius.

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