3
1
Back

Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x22, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x37, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x37, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x32 1.00mm double row Through hole angled pin header THT 1x40 1.00mm single row style1 pin1 left Surface mounted socket strip THT 1x40 2.54mm single row Surface mounted socket strip SMD 1x31 2.54mm single row Through hole socket strip SMD 2x19 2.00mm double row Through hole straight pin header, 1x22, 2.54mm pitch, single row style2 pin1 right Through hole pin header THT 1x25 1.00mm single row Through hole angled socket strip, 2x34, 1.00mm pitch, double rows Through hole angled socket strip THT 1x28 2.00mm single row Through hole Samtec HPM power header series 3.81mm post length THT 1x05 1.27mm single row Through hole angled socket strip, 1x26, 2.54mm pitch, double rows.

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