3
1
Back

300mil 8-lead dip package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 15.24mm 600mil Socket LongPads 64-lead though-hole mounted DIP.

New Pull Request