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Large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1021 (alternative finishes: 43045-140x.

• 2 + hole_diameter + hole_margin*2; cutout_width = board_width.
• Definition, 0.704x1.054mm, 6 Ball.

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