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Female XT60, through hole, DF11-16DP-2DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10 Pin (https://www.nxp.com/docs/en/data-sheet/PCF85063A.pdf#page=48), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 24 Pin (JEDEC MO-153 Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE, 29 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (JEDEC MO-241/VAA, https://assets.nexperia.com/documents/package-information/SOT762-1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-LC, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xx-DV-PE-LC, 20 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 5.5, Wuerth electronics 9774100482 (https://katalog.we-online.de/em/datasheet/9774100482.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, BM11B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 87437-1443, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 28 Pin (JEDEC MO-153 Var BE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wire, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

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