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Type-2 TO-220-4 Vertical RM 0.9mm staggered type-1 TO-220F-15, Vertical, RM 0.9mm, staggered type-2 TO-220-7, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-5, Vertical, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-5, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 1.7mm staggered type-2 TO-220-4 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm TO-220F-4, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 10.9mm TO-247-2, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 5.08mm TO-220-3, Horizontal, RM 2.54mm, staggered type-1 TO-220-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 4 times 0.15 mm².

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