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BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x30 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x42, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x03 2.00mm double row surface-mounted straight pin header, 2x04, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header THT 2x25 2.54mm double row Through hole pin header SMD 1x16 1.00mm single row Surface mounted socket strip THT 1x28 2.54mm single row Through hole pin header SMD 2x21 2.54mm double row Through hole straight socket strip, 2x28, 2.00mm pitch.

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