Labels Milestones
BackQFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with thermal pad LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT401-1.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1106, With thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xx-DV-PE-LC, 34 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator JST SUR series connector, S2B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf.
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