3
1
Back

/ TQFP120 CASE 932AZ (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad.

New Pull Request