Labels Milestones
BackPowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads.
- 236-524 45Degree pitch 7.5mm.
- Normal 0.706045 -0.0555529 0.705985 vertex 6.47823 0.
- ACP CA9-H2,5 Potentiometer, horizontal, ACP CA14-H2,5.