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Dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=79), generated with kicad-footprint-generator connector wire 1sqmm strain-relief Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 32 Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0105, 5 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT414-1.pdf), generated with kicad-footprint-generator JST XA series connector, 202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 6x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch.

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