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Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XA series connector, S2B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxSH SIP DCDC-Converter XP_POWER ITxxxxxS.

• HLE-150-02-xxx-DV-BE-A, 50 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with.
• 0.0942433 0.0285897 0.995139 vertex -0.100274 7.51042 6.0001.

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