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BackSource: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf), generated with kicad-footprint-generator Hirose series connector, SM05B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator JST GH series connector, DF3EA-14P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001734B.pdf#page=50), generated with kicad-footprint-generator Hirose FH41, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-14A1, example for new mpn: 39-28-908x, 4 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-A, 29 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic QFN (2mm x 2mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification.
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