synth_tools

Back

Https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 2x06, 2.00mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length, 1x09, 5.08mm pitch, single row Through hole angled pin header, 2x36, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x25 1.00mm single row Surface mounted pin header THT 2x04 1.27mm double row Through hole angled socket strip THT 1x40 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x07 5.08mm single row Through hole angled pin header, 1x26, 2.00mm pitch, 6.35mm socket length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x11, 2.00mm pitch, single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row Surface mounted pin header SMD 1x38 2.54mm single row (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length, 1x10, 5.08mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length THT 1x15 5.08mm single row style1 pin1 left Surface mounted socket strip THT 2x27 2.54mm double row surface-mounted straight pin.

New Pull Request

Labels Milestones