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DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA.

• Ettinger 13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ with.
• IgnoreMountHoles=false cube([hp*panelHp,panelOuterHeight,panelThickness]); if (deepJackHoles) .

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