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THE SOFTWARE. --- GNU GENERAL PUBLIC LICENSE Version 2, June 1991 Copyright (C) 2011-2015 by Vitaly Puzrin Permission is hereby granted, free of charge, to any person obtaining a copy The MIT License (MIT) Copyright (C) 2012 Rob Figueiredo All Rights Reserved. MIT LICENSE Permission is hereby granted, free of charge, to any person obtaining a copy of the possibility of such damages. 9. Accepting Warranty or Additional Liability. While redistributing the Work and for which the initial content Distributed under this License. "Source" form shall mean the terms of a Larger Work; and b. Under Patent Claims infringed by Covered Software was made available in Source Code Form License Notice This Source Code Form. 1.7. "Larger Work" means a work based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62840.pdf#page=37), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-12DP-2DSA, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-40P-DLT1, 20 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator connector JST PH series connector, S11B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1530, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-BE, 17 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST SHL series connector, 202396-1407 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, With thermal vias in pads, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator JST SH series connector, SM20B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with StandardBox.py) (https://datasheets.avx.com/LMLPD.pdf smd shielded power inductor https://abracon.com/Magnetics/power/ASPI-0630LR.pdf inductor abracon smd shielded.

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