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Clock in (j2/j11 // casc out (j14/j15) // reset/casc in (j1/j13) // gate out (j4/j10 // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13) // gate out (j4/j10 // clock in (j2/j11 // casc out (j14/j15) // reset/casc in (j1/j13 // gate out (j4/j10) // clock out (j5/j12) // glide atten (rv15 // 13 SPDT switches 13 SPDT switches 13 SPDT switches 1 rotary switch with LCD screen E3 SAxxxx switch normally-open pushbutton push-button LCD D MEC 5G single pole double throw, separate symbols aa68d7a21d Am totally not using git correctly More experimentation with panel alignment before printing Add notes about UX component wiring 2x Sockets, all three pins need wires: - glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Clock POT is too small for a single 0.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://ww1.microchip.com/downloads/en/devicedoc/00002117f.pdf#page=70), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338), generated with kicad-footprint-generator Molex PicoBlade series connector, DF3EA-06P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-180 , 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip THT 2x35 2.00mm double row Through hole pin header SMD 2x04 1.00mm double row Through hole straight pin header, 2x40, 1.00mm pitch, single row style2 pin1 right Through hole straight socket strip, 1x37, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x27, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header SMD 1x08 1.27mm single row (from Kicad 4.0.7!), script generated Through hole angled pin header THT 2x17 2.54mm double row surface-mounted straight socket strip, 2x17, 1.27mm pitch, double rows Surface mounted pin header THT.

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