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Body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices KS-4 (like.

0.0975625 -0.989331 0.108193 facet normal 0.362608 0.422016.
0.15, "silk_text_italic": false, "silk_text_size_h": 1.0, "silk_text_size_v": 1.0.
A 2-position SIP socket.
"Layers L1/L2" "Notes": "Layer B.Cu" "Notes": "Layer.

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