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Back

TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF DFN, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-11P-1.25DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTB_2,5/9-GF; number of pins: 16; pin pitch: 5.08mm; Vertical || order number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/11-G-5,08; number of pins: 08; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/15-GF-3.5; number of pins: 03; pin pitch: 7.62mm; Angled.

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