synth_tools

Back

Phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for Siemens SFH900 reflex photo interrupter/coupler/object detector, see https://www.batronix.com/pdf/sfh900.pdf Siemens SFH900 reflex photo interrupter coupler object detector Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MINICAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Vishay CNY70 refective photo coupler package for Everlight ITR8307 with PCB locator, 11 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0415-4-51, 15 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, AFC07-S06FCA-00, 6 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 2, Wuerth electronics 9774120960 (https://katalog.we-online.de/em/datasheet/9774120960.pdf,), generated with kicad-footprint-generator Capacitor SMD Kemet-D (7343-31 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 6, Wuerth electronics 9771130360 (https://katalog.we-online.com/em/datasheet/9771130360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xx-DV-TE, 32 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-15P-1.25DS, 15 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.3mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310591_RT063xxHBWC_OFF-022684T.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00048, 5 pins, pitch 5mm, size 45x9mm^2, drill.

New Pull Request

Labels Milestones