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BackFootprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 18 leads; body width 4.4 mm; Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin, exposed pad Micrel MLF, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xxx-DV, 12 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, 2.54mm pitch, double rows Through hole socket strip SMD 1x03 1.27mm single row style2 pin1 right Through hole socket strip THT 1x37 1.00mm single row style2 pin1 right Through hole angled pin header, 2x40, 2.54mm pitch, double rows Surface mounted pin header THT 1x40 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x04 2.00mm double row surface-mounted straight socket strip, 2x17, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight.
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