Labels Milestones
BackGrid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x20, 1.27mm pitch, double rows Through hole straight pin header, 2x21, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled socket strip THT 1x27 1.27mm single row style2 pin1 right Through hole straight socket strip, 1x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x20 1.00mm double row surface-mounted straight socket strip, 1x23, 2.54mm pitch, 6mm pin length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled socket strip, 2x23, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header SMD 2x08 1.00mm double row Connector Phoenix Contact connector footprint for: MSTB_2,5/15-GF-5,08; number of pins: 02; pin pitch: 5.08mm.
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