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BackFiles *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated.
- -9.758449e+01 9.171143e+01 2.550000e+00 facet normal 0.552322 -0.106057 -0.826857.
- Kevin Burke. Permission is hereby granted, free of.
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- 0.0991387 vertex 6.47214 4.70228 20 facet.
- 1.016538e+02 1.855000e+01 vertex -1.015466e+02 1.047674e+02.