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Package (MR) - 9x9x0.9 mm Body [HTSSOP], with thermal vias in pads, 3 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Pico-EZmate series connector, BM16B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator.

-8.570009e-05 -1.000000e+00 0.000000e+00 0.000000e+00 facet normal.
9.14279 0 3.76384 facet normal 0.643675 0.528237 0.553758.

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