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(http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 20 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.15 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00068 pitch 7.5mm Varistor, diameter 7mm, width 3.7mm, pitch 5mm size 60x7.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00045 pitch 5mm size 82.3x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 10686, 9 pins, pitch 5mm, size 10x10.5mm^2, drill diamater 1.3mm, pad diameter 2mm.

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